Digitizer and electronic apparatus having the same

ABSTRACT

A digitizer includes a base member including a front surface and a rear surface opposing the front surface, first sensing lines disposed on the base member, arranged in a second direction, and extending in a first direction crossing the first direction, and second sensing lines disposed on the base member, spaced apart from the first sensing lines, arranged in the first direction, and extending in the second direction. The base member is foldable about an imaginary folding axis extending in the second direction and is provided with a through-hole penetrating at least a portion of the base member. The through-hole is surrounded by the first sensing lines and the second sensing lines.

This application is a divisional of U.S. patent application Ser. No.17/355,667, filed on Jun. 23, 2021, which claims priority to KoreanPatent Application No. 10-2020-0112903, filed on Sep. 4, 2020, and allthe benefits accruing therefrom under 35 U.S.C. § 119, the content ofwhich in its entirety is herein incorporated by reference.

BACKGROUND 1. Field of Disclosure

The present disclosure relates to an electronic apparatus. Moreparticularly, the present disclosure relates to an electronic apparatusincluding a digitizer with improved folding characteristics.

2. Description of the Related Art

In the information society, an electronic apparatus is becomingincreasingly important as media for transmission of visual information.As currently known electronic apparatuses, there are a liquid crystaldisplay (“LCD”), a plasma display panel (“PDP”), an organic lightemitting display (“OLED”), a field effect display (“FED”), and anelectrophoretic display (“EPD”).

The electronic apparatus is activated in response to electrical signalsapplied thereto. The electronic apparatus includes a digitizer thatsenses an external input applied thereto from the outside of a displaypanel displaying an image.

The electronic apparatus includes various electrode patterns to beactivated by the electrical signals. Areas in which the electrodepatterns are activated display information or respond to the externalsignal.

SUMMARY

The present disclosure provides an electronic apparatus including adigitizer with improved folding characteristics by defining athrough-hole through a base member of the digitizer.

Embodiments of the inventive concept provide a digitizer including abase member including a front surface and a rear surface opposing thefront surface, first sensing lines disposed on the base member, arrangedin a first direction, and extending in a second direction crossing thefirst direction, and second sensing lines disposed on the base member,spaced apart from the first sensing lines, arranged in the seconddirection, and extending in the first direction. The base member isfoldable about an imaginary folding axis extending in the seconddirection and is provided with a through-hole penetrating at least aportion thereof, and the through-hole is surrounded by the first sensinglines and the second sensing lines.

The through-hole may have a width equal to or greater than about 10micrometers and equal to or smaller than about 300 micrometers in thefirst direction.

The through-hole may be provided in plural, and the through-holes may bearranged in the first direction and the second direction to be spacedapart from each other.

The first and second sensing lines may be embedded in the base member.

The base member may include a first line area in which the first sensingline is disposed, where the first sensing lines are adjacent to thefront surface of the base member, a second line area in which the secondsensing line is disposed, where the second sensing lines are adjacent tothe rear surface of the base member, and a non-line area defined betweenthe first line area and the second line area in a plan view. Thethrough-hole may overlap the non-line area in the plan view andpenetrate the base member from the front surface of the base member tothe rear surface of the base member.

The base member may define a first additional hole which overlaps thefirst line area in the plan view and is defined from the rear surface ofthe base member with a certain depth.

The base member may define a second additional hole which overlaps thesecond line area in the plan view and is defined from the front surfaceof the base member with a certain depth.

The base member may include polyimide.

The base member may include a base layer including a front surface onwhich the first sensing lines are disposed and a rear surface on whichthe second sensing lines are disposed, a first photosensitive resinlayer disposed on the front surface of the base layer and providing thefront surface of the base member, and a second photosensitive resinlayer disposed on the rear surface of the base layer and providing therear surface of the base member. The rear surface may face the frontsurface. The front surface of the base layer may include a first linearea in which the first sensing lines are disposed and a first non-linearea defined between the first sensing lines, and the rear surface ofthe base layer includes a second line area in which the second sensinglines are disposed and a second non-line area defined between the secondsensing lines.

The through-hole may include a first through-hole overlapping the firstnon-line area in the plan view and penetrating the first photosensitiveresin layer to expose the front surface of the base layer and a secondthrough-hole overlapping the second non-line area in the plan view andpenetrating the second photosensitive resin layer to expose the rearsurface of the base layer.

The base member may further define a first additional hole overlappingthe first line area and defined from the front surface of the basemember with a certain depth and a second additional hole overlapping thesecond line area and defined from the rear surface of the base memberwith a certain depth.

The through-hole may include a first through-hole and a secondthrough-hole which have different widths from each other.

The through-hole may have a width equal to or greater than about 1millimeter and equal to or smaller than about 5 millimeters in thesecond direction.

The through-hole may have a depth equal to or greater than about 10micrometers and equal to or smaller than about 50 micrometers in a thirddirection. The third direction may cross the first direction and thesecond direction.

Embodiments of the inventive concept provide an electronic apparatusincluding a window, a display module disposed under the window, and adigitizer disposed under the display module. The digitizer includes abase member including a front surface adjacent to the display module anda rear surface opposing the front surface; and first and second sensinglines disposed on the base member, arranged in a first direction and asecond direction, respectively, spaced apart and insulated from eachother. The second direction crosses the first direction. The displaymodule is foldable about an imaginary folding axis extending in thesecond direction, the digitizer is provided with a through-holepenetrating at least a portion of the base member, and the through-holeis surrounded by the first sensing lines and the second sensing lines.

The through-hole may have a width equal to or greater than about 10micrometers and equal to or smaller than about 300 micrometers in thefirst direction.

The first and second sensing lines may be embedded in the base member.

The base member may include a first line area in which the first sensingline is disposed, a second line area in which the second sensing line isdisposed, and a non-line area defined between the first line area andthe second line area in a plan view. The through-hole may overlap thenon-line area in the plan view and penetrate the base member from thefront surface of the base member to the rear surface of the base member.

The base member may define a first additional hole overlapping the firstline area and defined from the rear surface of the base member with acertain depth and a second additional hole overlapping the second linearea and defined from the front surface of the base member with acertain depth.

The base member may include a base layer including a front surface onwhich the first sensing lines are disposed and a rear surface on whichthe second sensing lines are disposed, a first photosensitive resinlayer disposed on the front surface of the base layer and providing thefront surface of the base member, and a second photosensitive resinlayer disposed on the rear surface of the base layer and providing therear surface of the base member. The rear surface may face the frontsurface. The front surface of the base layer may include a first linearea in which the first sensing lines are disposed and a first non-linearea defined between the first sensing lines, and the rear surface ofthe base layer includes a second line area in which the second sensinglines are disposed and a second non-line area defined between the secondsensing lines.

The through-hole may include a first through-hole overlapping the firstnon-line area in the plan view and penetrating the first photosensitiveresin layer to expose the front surface of the base layer and a secondthrough-hole overlapping the second non-line area in the plan view andpenetrating the second photosensitive resin layer to expose the rearsurface of the base layer.

The base member may further define a first additional hole overlappingthe first line area and defined from the front surface of the basemember with a certain depth and a second additional hole overlapping thesecond line area and defined from the rear surface of the base memberwith a certain depth.

The through-hole may have a width equal to or greater than about 1millimeter and equal to or smaller than about 5 millimeters in thesecond direction.

The through-hole may have a depth equal to or greater than about 10micrometers and equal to or smaller than about 50 micrometers in a thirddirection. The third direction may cross the first direction and thesecond direction.

According to the above, the digitizer is provided with the through-holedefined by removing at least a portion thereof, and thus, a stressapplied to the digitizer when the digitizer is folded is effectivelyreduced. Accordingly, a reliability of the digitizer is improved, andthe electronic apparatus has improved folding characteristics.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other advantages of the present disclosure will becomereadily apparent by reference to the following detailed description whenconsidered in conjunction with the accompanying drawings wherein:

FIG. 1A is a perspective view showing an electronic apparatus accordingto an embodiment of the present disclosure;

FIG. 1B is a perspective view showing an electronic apparatus accordingto an embodiment of the present disclosure;

FIG. 1C is a plan view showing an electronic apparatus in a folded stateaccording to an embodiment of the present disclosure;

FIG. 1D is a perspective view showing an electronic apparatus accordingto an embodiment of the present disclosure;

FIG. 2A is a cross-sectional view showing an electronic apparatusaccording to an embodiment of the present disclosure;

FIG. 2B is a cross-sectional view showing an electronic apparatusaccording to an embodiment of the present disclosure;

FIG. 2C is a cross-sectional view showing an electronic apparatusaccording to an embodiment of the present disclosure;

FIG. 3A is a plan view showing a display panel according to anembodiment of the present disclosure;

FIG. 3B is an equivalent circuit diagram showing a pixel according to anembodiment of the present disclosure;

FIG. 4 is a plan view showing a digitizer according to an embodiment ofthe present disclosure;

FIG. 5 is a plan view showing a digitizer according to an embodiment ofthe present disclosure;

FIG. 6 is a cross-sectional view showing a portion of an electronicapparatus according to an embodiment of the present disclosure;

FIG. 7A is a plan view showing a digitizer according to an embodiment ofthe present disclosure;

FIG. 7B is a cross-sectional view showing the digitizer taken along aline I-I′ shown in FIG. 7A;

FIG. 8 is a cross-sectional view showing a digitizer according to anembodiment of the present disclosure;

FIG. 9 is a cross-sectional view showing a digitizer according toanother embodiment of the present disclosure;

FIG. 10 is a cross-sectional view showing a digitizer according to stillanother embodiment of the present disclosure; and

FIG. 11 is a cross-sectional view showing a digitizer according to yetanother embodiment of the present disclosure.

DETAILED DESCRIPTION

In the present disclosure, it will be understood that when an element orlayer is referred to as being “on”, “connected to” or “coupled to”another element or layer, it can be directly on, connected or coupled tothe other element or layer or intervening elements or layers may bepresent.

Like numerals refer to like elements throughout. In the drawings, thethickness, ratio, and dimension of components are exaggerated foreffective description of the technical content.

As used herein, the term “and/or” may include any and all combinationsof one or more of the associated listed items.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, component, region, layer or section fromanother region, layer or section. Thus, a first element, component,region, layer or section discussed below could be termed a secondelement, component, region, layer or section without departing from theteachings of the present disclosure. As used herein, the singular forms,“a”, “an” and “the” are intended to include the plural forms as well,unless the context clearly indicates otherwise.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures.

It will be understood that, although the terms “first,” “second,”“third” etc. may be used herein to describe various elements,components, regions, layers and/or sections, these elements, components,regions, layers and/or sections should not be limited by these terms.These terms are only used to distinguish one element, component, region,layer or section from another element, component, region, layer orsection. Thus, “a first element,” “component,” “region,” “layer” or“section” discussed below could be termed a second element, component,region, layer or section without departing from the teachings herein.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

It will be further understood that the terms “may include” and/or“including”, when used in this specification, specify the presence ofstated features, integers, steps, operations, elements, and/orcomponents, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, elements, components,and/or groups thereof. Hereinafter, the present disclosure will beexplained in detail with reference to the accompanying drawings.

FIG. 1A is a perspective view showing an electronic apparatus EAaccording to an embodiment of the present disclosure. FIG. 1B is aperspective view showing the electronic apparatus EA according to anembodiment of the present disclosure. FIG. 1C is a plan view showing theelectronic apparatus EA in a folded state according to an embodiment ofthe present disclosure. FIG. 1D is a perspective view showing theelectronic apparatus according to an embodiment of the presentdisclosure.

Referring to FIG. 1A, the electronic apparatus EA may be an apparatusactivated in response to an electrical signal. The electronic apparatusEA may include various embodiments. For example, the electronicapparatus EA may include a tablet computer, a notebook computer, acomputer, or a smart television. In an embodiment, a smartphone will bedescribed as the electronic apparatus EA.

The electronic apparatus EA may include a first display surface FS thatis substantially parallel to each of a first direction DR1 and a seconddirection DR2 in an unfolded state. The electronic apparatus EA maydisplay an image IM through the first display surface FS toward a thirddirection DR3. The first display surface FS through which the image IMis displayed may correspond to a front surface of the electronicapparatus EA. The image IM may include a video and a still image. FIG.1A shows an internet search box as an example of the image IM.

In an embodiment, front (i.e., upper) and rear (i.e., lower) surfaces ofeach member of the electronic apparatus EA may be defined with respectto a direction in which the image IM is displayed. The front and rearsurfaces may face each other in the third direction DR3, and a normalline direction of each of the front and rear surfaces may besubstantially parallel to the third direction DR3.

A distance between the front surface and the rear surface in the thirddirection DR3 may correspond to a thickness or a height of theelectronic apparatus EA in the third direction DR3. Directions indicatedby the first, second, and third directions DR1, DR2, and DR3 may berelative to each other and may be changed to other directions.

The electronic apparatus EA may sense an external input applied theretofrom an outside. The external input may include various forms of inputsprovided from the outside of the electronic apparatus EA.

In an embodiment, the external inputs may include a proximity input(e.g., hovering) applied when approaching close to or adjacent to theelectronic apparatus EA at a predetermined distance as well as a touchinput by a user's body (e.g., user's hand). In addition, the externalinputs may be provided in the form of force, pressure, temperature,light, etc.

FIG. 1A shows an example of the external inputs caused by a pen SP of auser. Although not shown in figures, the pen SP may be attached to ordetached from the electronic apparatus EA, and the electronic apparatusEA may provide or receive signals corresponding to the attachment anddetachment of the pen SP.

The electronic apparatus EA according to an embodiment may include thefirst display surface FS and a second display surface RS. The firstdisplay surface FS may include a first active area F-AA, a firstperipheral area F-NAA, and an electronic module area EMA. The seconddisplay surface RS may be opposite to at least a portion of the firstdisplay surface FS.

The first active area F-AA may be activated in response to theelectrical signal. The image IM may be displayed through the firstactive area F-AA, and various external inputs may be sensed through thefirst active area F-AA.

The first peripheral area F-NAA may be defined adjacent to the firstactive area F-AA. The first peripheral area F-NAA may have apredetermined color. The first peripheral area F-NAA may surround thefirst active area F-AA. Accordingly, the first active area F-AA may besubstantially defined by the first peripheral area F-NAA, however, thisis merely exemplary. The first peripheral area F-NAA may be definedadjacent to only one side of the first active area F-AA or may beomitted.

Various electronic modules may be disposed in the electronic module areaEMA. For example, the electronic module may include at least one of acamera, a speaker, an optical digitizer, and a thermal digitizer. Theelectronic module area EMA may sense an external subject through thedisplay surfaces FS and RS or may provide a sound signal, such as avoice, to the outside through the display surfaces FA and RS. Inaddition, the electronic module may include a plurality of components,however, it should not be limited to a particular embodiment.

The electronic module area EMA may be surrounded by the first activearea F-AA and the first peripheral area F-NAA. However, the location ofthe electronic module area EMA according to the invention should not belimited thereto or thereby. The electronic module area EMA may bedefined in the first active area F-AA in another embodiment, and theelectronic module area EMA should not be particularly limited.

The electronic apparatus EA according to an embodiment may include atleast one folding area FA and a plurality of non-folding areas NFA1 andNFA2 extending from the folding area FA.

Referring to FIG. 1B, the electronic apparatus EA may include a firstfolding axis AX1 that is imaginary and extends in the second directionDR2. The first folding axis AX1 may extend in the second direction DR2on the first display surface FS. In an embodiment, the non-folding areasNFA1 and NFA2 may extend from the folding area FA with the folding areaFA interposed therebetween.

In an embodiment, a first n0n-folding area NFA1 may extend from one sideof the folding area FA in the first direction DR1, and a secondn0n-folding area NFA2 may extend from the other side of the folding areaFA in the first direction DR1.

The electronic apparatus EA may be foldable about the first folding axisAX1 to be in an in-folding state where one area of the first displaysurface FS, which overlaps the first non-folding area NFA1, faces theother area of the first display surface FS, which overlaps the secondnon-folding area NFA2.

Referring to FIG. 1C, the second display surface RS may be viewed by auser during the in-folding state of the electronic apparatus EA. In thiscase, the second display surface RS may include a second active areaR-AA through which the image is displayed. The second active area R-AAmay be activated in response to electrical signals. The second activearea R-AA may be an area through which the image is displayed andvarious external inputs are sensed.

A second peripheral area R-NAA may be defined adjacent to the secondactive area R-AA. The second peripheral area R-NAA may have apredetermined color. The second peripheral area R-NAA may surround thesecond active area R-AA. In addition, although not shown in figures, thesecond display surface RS may further include an electronic module areain which an electronic module including various components is disposed,and the second display surface RS according to the invention should notbe particularly limited.

Referring to FIG. 1D, the electronic apparatus EA may include a secondfolding axis AX2 that is imaginary and extends in the second directionDR2. The second folding axis AX2 may extend in the second direction DR2on the second display surface RS.

The electronic apparatus EA may be foldable about the second foldingaxis AX2 to be in an out-folding state where one area of the seconddisplay surface RS, which overlaps the first non-folding area NFA1,faces the other area of the second display surface RS, which overlapsthe second non-folding area NFA2.

However, the electronic apparatus EA according to the invention shouldnot be limited thereto or thereby. The electronic apparatus EA may befoldable about a plurality of folding axes such that a portion of thefirst display surface FS and a portion of the second display surface RSface each other, and the number of the folding axes and the number ofnon-folding areas according to the invention should not be particularlylimited.

FIG. 2A is a cross-sectional view showing an electronic apparatus EAaccording to an embodiment of the present disclosure. FIG. 2B is across-sectional view showing an electronic apparatus EA-1 according toan embodiment of the present disclosure. FIG. 2C is a cross-sectionalview showing an electronic apparatus EA-2 according to an embodiment ofthe present disclosure.

Referring to FIG. 2A, the electronic apparatus EA may include a windowWM, an optical member OM, a display module DM, a lower film FM, aprotective member PM, and a digitizer ZM.

The window WM may be disposed on the display module DM. The window WMmay be coupled to a housing (not shown) to define an exterior of theelectronic apparatus EA and may protect the display module DM.

The window WM may include a material having a high light transmittance.For example, the window WM may include a glass substrate, a sapphiresubstrate, or a plastic film. The window WM may have a single-layer ormulti-layer structure.

In an embodiment, the window WM may have a stack structure of aplurality of plastic films attached to each other by an adhesive or astack structure of the glass substrate and the plastic film attached tothe glass substrate by an adhesive. Although not shown in figures,functional layers may be further disposed on the window WM to protectthe window WM. For example, the functional layers may include at leastone of an anti-fingerprint layer and an impact absorbing layer, however,the kinds of the functional layers according to the invention should notbe particularly limited.

The optical member OM may be disposed under the window WM. The opticalmember OM may reduce an external light reflectance of the display moduleDM with respect to the light incident to the display module DM. Forexample, the optical member OM may include at least one of ananti-reflective film, a polarizing film, a color filter, and a grayfilter.

The display module DM may serve as an output device. For example, thedisplay module DM may display the image through the active areas F-AAand R-AA, and the user may acquire information through the image. Inaddition, the display module DM may serve as an input device to sensethe external input applied to the active areas F-AA and R-AA.

The lower film FM may be disposed under the display module DM. The lowerfilm FM may reduce a stress applied to the display module DM when theelectronic apparatus EA is folded. In addition, the lower film FM mayprevent external moisture from entering the display module DM and mayabsorb external impacts.

The lower film FM may include a plastic film as its base layer. Thelower film FM may include a plastic film including any one selected fromthe group consisting of polyethersulfone (“PES”), polyacrylate,polyetherimide (“PEI”), polyethylene naphthalate (“PEN”), polyethyleneterephthalate (“PET”), polyphenylene sulfide (“PPS”), polyarylate,polyimide (“PI”), polycarbonate (“PC”), poly(arylene ether sulfone), andcombinations thereof.

The material for the lower film FM according to the invention should notbe limited to plastic resins and may include an organic-inorganiccomposite material in another embodiment. The lower film FM may includea porous organic layer and an inorganic material filled in pores of theorganic layer.

The lower film FM may further include a functional layer formed on theplastic film. The functional layer may include a resin layer. Thefunctional layer may be formed by a coating method.

The protective member PM may be disposed under the display module DM.The protective member PM may include at least one functional layer thatprotects the display module DM. For example, the protective member PMmay include a light shielding layer, a heat dissipating layer, a cushionlayer, and a plurality of adhesive layers.

The light shielding layer may improve a phenomenon in which componentsdisposed in the display module DM are viewed through the window WMthrough the active areas F-AA and R-AA. Although not shown in figures,the light shielding layer may include a binder and a plurality ofpigment particles dispersed in the binder. The pigment particles mayinclude a carbon black. As the electronic apparatus EA according to theembodiment includes the protective member PM including the lightshielding layer, a light shielding effect may be improved.

The heat dissipating layer may effectively dissipate heat generated bythe display module DM. The heat dissipating layer may include at leastone of graphite, copper (Cu), and aluminum (Al) having superior heatdissipation characteristics, however, the material included in the heatdissipating layer according to the invention should not be limitedthereto or thereby. The heat dissipating layer may improve the heatdissipation characteristics and may have electromagnetic wave shieldingcharacteristics or electromagnetic wave absorption characteristics.

The cushion layer may be a synthetic resin foam. The cushion layer mayinclude a matrix and a plurality of pores. The cushion layer may have anelasticity and may have a porous structure.

The matrix may include a flexible material. The matrix may include asynthetic resin. For example, the matrix may include at least one ofacrylonitrile butadiene styrene copolymer (“ABS”), polyurethane (“PU”),polyethylene (“PE”), ethylene vinyl acetate (“EVA”), and polyvinylchloride (“PVC”).

The pores may absorb impacts applied to the cushion layer. The pores maybe defined by the porous structure of the cushion layer.

However, the present disclosure should not be limited thereto orthereby. At least one of the light shielding layer, the heat dissipatinglayer, and the cushion layer may be omitted and the plural layers may beprovided in a single-layer structure in another embodiment, and theyshould not be particularly limited.

The digitizer ZM may be disposed under the display module DM. Thedigitizer ZM may sense the signal transmitted by the pen SP (refer toFIG. 1A) among the external inputs. The digitizer ZM may sense theexternal inputs by an electromagnetic resonance (“EMR”) method.According to the EMR method, a resonant circuit provided in the pen SPgenerates a magnetic field, the vibrating electric field induces signalsto a plurality of coils included in the digitizer ZM, and a position ofthe pen SP is detected based on the signals induced to the coils. Thedigitizer ZM will be described in detail later.

In the present embodiment, the digitizer ZM, the protective member PM,the lower film FM, the display module DM, and the optical member OM maybe sequentially arranged in the third direction DR3 in the electronicapparatus EA.

Although not shown in figures, the components included in the electronicapparatus EA may be coupled to each other by adhesive layers disposedbetween the components. Hereinafter, the adhesive layers may be anoptically clear adhesive (“OCA”) film, an optically clear resin (“OCR”),or a pressure sensitive adhesive (“PSA”) film. In addition, the adhesivelayers may include a light-curable adhesive material or a heat-curableadhesive material, however, the material included in the adhesive layersaccording to the invention should not be particularly limited.

Referring to FIG. 2B, the electronic apparatus EA-1 may include a windowWM-1, an optical member OM-1, a display module DM-1, a lower film FM-1,a digitizer ZM-1, and a protective member PM-1. Components included inthe electronic apparatus EA-1 shown in FIG. 2B may be substantially thesame as the components included in the electronic apparatus EA describedwith reference to FIG. 2A, and only differences according to thestacking order will be described.

In the present embodiment, the protective member PM-1, the digitizerZM-1, the lower film FM-1, the display module DM-1, the optical memberOM-1, and the window WM-1 of the electronic apparatus EA-1 may besequentially arranged in the third direction DR3.

Referring to FIG. 2C, the electronic apparatus EA-2 may include a windowWM-2, an optical member OM-2, a display module DM-2, a digitizer ZM-2, alower film FM-2, and a protective member PM-2. Components included inthe electronic apparatus EA-2 shown in FIG. 2C may be substantially thesame as the components included in the electronic apparatus EA describedwith reference to FIG. 2A, and only differences according to thestacking order will be described.

In the present embodiment, the protective member PM-2, the lower filmFM-2, the digitizer ZM-2, the display module DM-2, the optical memberOM-2, and the window WM-2 of the electronic apparatus EA-2 may besequentially arranged in the third direction DR3.

FIG. 3A is a plan view showing a display panel DP according to anembodiment of the present disclosure. FIG. 3B is an equivalent circuitdiagram showing a pixel PX according to an embodiment of the presentdisclosure. FIG. 4 is a plan view showing a digitizer according to anembodiment of the present disclosure. In FIGS. 3A, 3B, and 4 , the samereference numerals denote the same elements in FIGS. 1A to 1D and 2A to2C, and thus, detailed descriptions of the same elements will beomitted. The display module DM, DM-1 and DM-2 described with referenceto FIGS. 2A to 2C may include a display panel DP and an input sensingpanel ISL.

Referring to FIG. 3A, the display panel DP may include a plurality ofpixels PX, a plurality of signal lines GL, DL, PL, and ECL, and aplurality of display pads PDD.

The display panel DP may include a display area DA through which theimage is displayed and a non-display area NDA in which a driving circuitor a driving line is disposed. The display area DA may overlap at leasta portion of the active areas F-AA and R-AA of the electronic apparatusEA. In addition, the non-display area NDA may overlap the peripheralareas F-NAA and R-NAA of the electronic apparatus EA in a plan view.

The signal lines GL, DL, PL, and ECL may be connected to the pixels PXto apply electrical signals to the pixels PX. Among the signal linesincluded in the display panel DP, a scan line GL, a data line DL, apower line PL, and a light emitting control line ECL are shown as arepresentative example, however, this is merely exemplary. The signallines GL, DL, PL, and ECL may further include an initialization voltageline, and the signal lines GL, DL, PL, and ECL should not beparticularly limited.

The pixels PX may be arranged in the first direction DR1 and the seconddirection DR2 and may be spaced apart from each other to form a matrixconfiguration in a plan view.

FIG. 3B shows an embodiment of a signal circuit diagram of one pixel PXamong the pixels PX. FIG. 3B shows the pixel PX connected to an i-thscan line GLi and an i-th light emitting control line ECLi.

The pixel PX may include a light emitting element EE and a pixel circuitCC. The pixel circuit CC may include a plurality of transistors T1 to T7and a capacitor CP. The transistors T1 to T7 may be formed through a lowtemperature polycrystalline silicon (“LTPS”) process or a lowtemperature polycrystalline oxide (“LTPO”) process.

The pixel circuit CC may control an amount of current flowing throughthe light emitting element EE in response to a data signal. The lightemitting element EE may emit a light at a predetermined luminance inresponse to the amount of the current provided from the pixel circuitCC. To this end, a first power voltage ELVDD has a voltage level sethigher than a voltage level of a second power voltage ELVSS. The lightemitting element EE may include an organic light emitting element or aquantum dot light emitting element.

Each of the transistors T1 to T7 may include an input electrode (orsource electrode), an output electrode (or drain electrode), and acontrol electrode (or gate electrode). In the present disclosure, forthe convenience of explanation, one electrode of the input electrode andthe output electrode may be referred to as a “first electrode”, and theother electrode of the input electrode and the output electrode may bereferred to as a “second electrode”.

A first electrode of the first transistor T1 is connected to the firstpower voltage ELVDD via a fifth transistor T5, and a second electrode ofthe first transistor T1 is connected to an anode electrode of the lightemitting element EE via a sixth transistor T6. The first transistor T1may be referred to as a “driving transistor” in the present disclosure.

The first transistor T1 controls the amount of the current flowingthrough the light emitting element EE in response to a voltage appliedto a control electrode of the first transistor T1.

The second transistor T2 is connected between the data line DL and thefirst electrode of the first transistor T1. A control electrode of thesecond transistor T2 is connected to the i-th scan line GLi. When ani-th scan signal is applied to the i-th scan line GLi, the secondtransistor T2 is turned on to electrically connect the data line DL tothe first electrode of the first transistor T1.

The third transistor T3 is connected between the second electrode of thefirst transistor T1 and the control electrode of the first transistorT1. A control electrode of the third transistor T3 is connected to thei-th scan line GLi. When the i-th scan signal is applied to the i-thscan line GLi, the third transistor T3 is turned on to electricallyconnect the second electrode of the first transistor T1 to the controlelectrode of the first transistor T1. Accordingly, when the thirdtransistor T3 is turned on, the first transistor T1 is connected in adiode configuration.

A fourth transistor T4 is connected between a node ND and aninitialization power generator (not shown). A control electrode of thefourth transistor T4 is connected to an (i-1)th scan line GLi-1. When an(i−1)th scan signal is applied to the (i−1)th scan line GLi-1, thefourth transistor T4 is turned on to apply an initialization voltageVint to the node ND.

A fifth transistor T5 is connected between the power line PL and thefirst electrode of the first transistor T1. A control electrode of thefifth transistor T5 is connected to the i-th light emitting control lineECLi.

A sixth transistor T6 is connected between the second electrode of thefirst transistor T1 and the anode electrode of the light emittingelement EE. A control electrode of the sixth transistor T6 is connectedto the i-th light emitting control line ECLi.

A seventh transistor T7 is connected between the initialization powergenerator (not shown) and the anode electrode of the light emittingelement EE. A control electrode of the seventh transistor T7 isconnected to an (i+1)th scan line GLi+1. When an (i+1)th scan signal isapplied to the (i+1)th scan line GLi+1, the seventh transistor T7 isturned on to apply the initialization voltage Vint to the anodeelectrode of the light emitting element EE.

The seventh transistor T7 may improve a black expression capability ofthe pixel PX. In detail, when the seventh transistor T7 is turned on, aparasitic capacitor (not shown) of the light emitting element EE isdischarged. Then, the light emitting element EE may not emit the lightdue to a leakage current from the first transistor T1 when blackluminance is displayed, and thus, the black expression capability may beimproved.

Additionally, the control electrode of the seventh transistor T7 isconnected to the (i+1)th scan line GLi+1 in FIG. 3B, however, thepresent disclosure should not be limited thereto or thereby. Accordingto another embodiment of the present disclosure, the control electrodeof the seventh transistor T7 may be connected to the i-th scan line GLior the (i−1)th scan line GLi-1.

The capacitor CP is connected between the power line PL and the node ND.The capacitor CP is charged with a voltage corresponding to the datasignal. When the fifth transistor T5 and the sixth transistor T6 areturned on by the voltage charged in the capacitor CP, the amount of thecurrent flowing through the first transistor T1 may be determined.

In the present disclosure, an equivalent circuit of the pixel PXaccording to the invention should not be limited to the equivalentcircuit shown in FIG. 3B. According to another embodiment, the pixel PXmay be implemented in various ways to allow the light emitting elementEE to emit the light. FIG. 3B shows a PMOS as a reference of the pixelcircuit CC, however, it should not be limited thereto or thereby.According to another embodiment, the pixel circuit CC may be implementedby an NMOS. According to another embodiment, the pixel circuit CC may beimplemented by a combination of the NMOS and the PMOS.

Referring to FIG. 3A again, a power pattern VDD may be disposed in thenon-display area NDA. In an embodiment, the power pattern VDD may beconnected to the power lines PL. Accordingly, the display panel DP mayinclude the power pattern VDD, and thus, the pixels PX may receive thesame first power supply signal.

The display pads PDD may include a first pad D1 and a second pad D2. Thefirst pad D1 may be provided in plural number, and the first pads D1 maybe connected to the data lines DL, respectively. The second pad D2 maybe connected to the power pattern VDD to be electrically connected tothe power line PL. The display panel DP may apply the electricalsignals, which are provided from the outside through the display padsPDD, to the pixels PX. The display pads PDD may further include pads toreceive other electrical signals in addition to the first and secondpads D1 and D2, and the display pads PDD according to the inventionshould not be limited to a particular embodiment.

Referring to FIG. 4 , the input sensing panel ISL may be disposed on thedisplay panel DP. The input sensing panel ISL may be formed directly onthe display panel DP through successive processes, and the input sensingpanel ISL according to the invention should not be particularly limited.As another way, the input sensing panel ISL may be coupled to thedisplay panel DP by a separate adhesive layer.

The input sensing panel ISL may include a first sensing electrode TE1, asecond sensing electrode TE2, a plurality of trace lines TL1, TL2, andTL3, and a plurality of sensing pads TP1, TP2, and TP3. The inputsensing panel ISL may include a sensing area SA and a non-sensing areaNSA. The non-sensing area NSA may surround the sensing area SA. Thesensing area SA may be a sensing area in which the input provided fromthe outside is sensed. The sensing area SA may overlap the display areaDA of the display panel DP in a plan view.

The input sensing panel ISL may sense the external input using aself-capacitance method or a mutual capacitance method. The firstsensing electrode TE1 and the second sensing electrode TE2 may bevariously modified, arranged, and connected according to theself-capacitance method or the mutual capacitance method.

The first sensing electrode TE1 may include first sensing patterns SP1and first bridge patterns BP1. The first sensing electrode TE1 mayextend in the first direction DR1 and may be arranged in the seconddirection DR2. The first sensing patterns SP1 may be arranged to bespaced apart from each other in the first direction DR1. At least onefirst bridge pattern BP1 may be disposed between two first sensingpatterns SP1 adjacent to each other.

The second sensing electrode TE2 may include second sensing patterns SP2and second bridge patterns BP2. The second sensing electrode TE2 mayextend in the second direction DR2 and may be arranged in the firstdirection DR1. The second sensing patterns SP2 may be arranged to bespaced apart from each other in the second direction DR2. At least onesecond bridge pattern BP2 may be disposed between two second sensingpatterns SP2 adjacent to each other.

The trace lines TL1, TL2, and TL3 may be arranged in the non-sensingarea NSA. The trace lines TL1, TL2, and TL3 may include a first traceline TL1, a second trace line TL2, and a third trace line TL3.

The first trace line TL1 may be connected to one end of the firstsensing electrode TEL The second trace line TL2 may be connected to oneend of the second sensing electrode TE2. The third trace line TL3 may beconnected to the other end of the second sensing electrode TE2. Theother end of the second sensing electrode TE2 may be opposite to the oneend of the second sensing electrode TE2.

According to the present disclosure, the second sensing electrode TE2may be connected to the second trace line TL2 and the third trace lineTL3. Accordingly, a sensitivity with respect to areas of the secondsensing electrode TE2 having a relatively longer length than that of thefirst sensing electrode TE1 may be uniformly maintained, however, thisis merely exemplary. The third trace line TL3 may be omitted, and thethird trace line TL3 according to the invention should not beparticularly limited.

The sensing pads TP1, TP2, and TP3 may be arranged in the non-sensingarea NSA. The sensing pads TP1, TP2, and TP3 may include a first sensingpad TP1, a second sensing pad TP2, and a third sensing pad TP3. Thefirst sensing pad TP1 may be connected to the first trace line TL1, andthus, may be electrically connected to the first sensing electrode TELThe second sensing pad TP2 may be connected to the second trace lineTL2, and the third sensing pad TP3 may be connected to the third traceline TL3. Therefore, the second sensing pad TP2 and the third sensingpad TP3 may be electrically connected to the second sensing electrodeTE2.

FIG. 5 is a plan view showing a digitizer ZM according to an embodimentof the present disclosure, and FIG. 6 is a cross-sectional view showinga portion of the electronic apparatus according to an embodiment of thepresent disclosure. In FIGS. 5 and 6 , the same reference numeralsdenote the same elements in FIGS. 1A to 1D, 2A to 2C, 3A, 3B, and 4 ,and thus, detailed descriptions of the same element will be omitted. Thedigitizer ZM according to the embodiment of the present disclosure maysense the external input by an electromagnetic resonance (EMR) method.

Referring to FIG. 5 , the digitizer ZM may include a base member PI,digitizer sensors RF1, RF2, CF1, and CF2, and a plurality of digitizerpads TC1 and TC2.

The base member PI may be a base layer on which the digitizer sensorsRF1, RF2, CF1, and CF2 are disposed. The base member PI may include anorganic material. For example, the base member PI may include polyimide(PI).

The first digitizer sensor RF1 may include a plurality of first sensinglines RF1-1, RF1-2, and RF1-3, the first digitizer sensor RF2 mayinclude a plurality of first sensing lines RF2-1, RF2-2, and RF2-3, thesecond digitizer sensor CF1 may include a plurality of second sensinglines CF1-1, CF1-2, and CF1-3, and the second digitizer sensor CF2 mayinclude a plurality of second sensing lines CF2-1, CF2-2, and CF2-3.

The first sensing lines RF1-1, RF1-2, RF1-3, RF2-1, RF2-2, and RF2-3 mayextend in the second direction DR2. The first sensing lines RF1-1,RF1-2, RF1-3, RF2-1, RF2-2, and RF2-3 may be arranged in the firstdirection DR1 to be spaced apart from each other. The direction in whichthe first sensing lines RF1-1, RF1-2, RF1-3, RF2-1, RF2-2, and RF2-3extend may be substantially the same as the direction of the foldingaxes AX1 and AX2 described with reference to FIGS. 1 B and 1C.

The second sensing lines CF1-1, CF1-2, CF1-3, CF2-1, CF2-2, and CF2-3may extend in the first direction DR1. The second sensing lines CF1-1,CF1-2, CF1-3, CF2-1, CF2-2, and CF2-3 may be arranged in the seconddirection DR2 to be spaced apart from each other.

The first digitizer sensors RF1 and RF2 may correspond to input coils ofthe digitizer ZM of the EMR method, and the second digitizer sensors CF1and CF2 may correspond to output coils of the digitizer ZM of the EMRmethod.

The first sensing lines RF1-1, RF1-2, RF1-3, RF2-1, RF2-2, and RF2-3 andthe second sensing lines CF1-1, CF1-2, CF1-3, CF2-1, CF2-2, and CF2-3may be arranged in the base member PI to be insulated from each other.Each of the first sensing lines RF1-1, RF1-2, RF1-3, RF2-1, RF2-2, andRF2-3 may be connected to corresponding first digitizer pad TC1, andeach of the second sensing lines CF1-1, CF1-2, CF1-3, CF2-1, CF2-2, andCF2-3 may be connected to corresponding second digitizer pad TC2.

The first sensing lines RF1-1, RF1-2, RF1-3, RF2-1, RF2-2, and RF2-3 mayreceive scan signals that are activated in different periods from eachother. Each of the first sensing lines RF1-1, RF1-2, RF1-3, RF2-1,RF2-2, and RF2-3 may generate a magnetic field in response to acorresponding scan signal.

When the pen SP (refer to FIG. 1A) approaches the first sensing linesRF1-1, RF1-2, RF1-3, RF2-1, RF2-2, and RF2-3, the magnetic field inducedby the first sensing lines RF1-1, RF1-2, RF1-3, RF2-1, RF2-2, and RF2-3may resonate with the resonant circuit of the pen SP. The pen SP maygenerate a resonant frequency. In an embodiment, the pen SP may includean LC resonant circuit including an inductor and a capacitor.

The second sensing lines CF1-1, CF1-2, CF1-3, CF2-1, CF2-2, and CF2-3may output the sensing signals in accordance with the resonant frequencyof the pen SP to the second digitizer pads TC2.

In the following descriptions, a center portion of an area where asecond coil RF2-2 among the first sensing lines RF1-1, RF1-2, RF1-3,RF2-1, RF2-2, and RF2-3 which crosses a second coil CF2-2 among thesecond sensing lines CF1-1, CF1-2, CF1-3, CF2-1, CF2-2, and CF2-3 isassumed as an input point PP.

In this example, the sensing signal output from the second coil RF2-2among the first sensing lines RF1-1, RF1-2, RF1-3, RF2-1, RF2-2, andRF2-3 may have a level higher than the sensing signals output from theother first sensing lines RF1-1, RF1-2, RF1-3, RF2-1, and RF2-3.

In this example, the sensing signal output from the second coil CF2-2among the second sensing lines CF1-1, CF1-2, CF1-3, CF2-1, CF2-2, andCF2-3 may have a level higher than the sensing signals output from theother second sensing lines CF1-1, CF1-2, CF1-3, CF2-1, and CF2-3.

In this example, the sensing signals output from a first coil CF2-1 anda third coil CF2-3 among the second sensing lines CF1-1, CF1-2, CF1-3,CF2-1, CF2-2, and CF2-3 may have a level lower than that of the sensingsignal output from the second coil CF2-2, and the sensing signals outputfrom the first coil CF2-1 and the third coil CF2-3 among the secondsensing lines CF1-1, CF1-2, CF1-3, CF2-1, CF2-2, and CF2-3 may have alevel higher than that of the sensing signals output from the othersecond sensing lines CF1-1, CF1-2, and CF1-3.

In this example, two-dimensional coordinate information of the inputpoint PP by the pen SP may be calculated based on a time when thesensing signal output from the second coil CF2-2 and having the highlevel is detected and a relative position of the second coil CF2-2 withrespect to the second sensing lines CF1-1, CF1-2, CF1-3, CF2-1, andCF2-3.

In the present disclosure, some of the sensing lines RF1-1, RF1-2,RF1-3, RF2-1, RF2-3, CF1-1, CF1-2, CF1-3, CF2-1, and CF2-3 may bepartially omitted in an area overlapping the folding area FA and may bespaced apart from the folding area FA in a plan view.

Referring to FIG. 6 , the digitizer ZM according to an embodiment mayinclude a front surface Z-U and a rear surface Z-B. The front surfaceZ-U may be disposed to be more adjacent to the display module DM thanthe rear surface Z-B is. In the present embodiment, the front surfaceZ-U may be relatively flat compared with the rear surface Z-B. That is,the front surface Z-U may be flatter than the rear surface Z-B. Thefront surface Z-U and the rear surface Z-B may have different surfaceroughness from each other.

The front surface Z-U that is relatively flat may be attached to a lowerportion of the protective member PM by the adhesive AL. According to thepresent disclosure, as the front surface Z-U that is relatively flatcompared with the rear surface Z-B is disposed adjacent to the displaymodule DM, a defect in which an irregular surface is viewed to the userdue to the light passing though the display module DM may be effectivelyprevented. Accordingly, the visibility of the electronic apparatus EAmay be improved.

FIG. 7A is a plan view showing a digitizer ZM-A according to anembodiment of the present disclosure, and FIG. 7B is a cross-sectionalview showing the digitizer ZM-A taken along a line I-I′ shown in FIG.7A. In FIGS. 7A and 7B, the same reference numerals denote the sameelements in FIGS. 1A to 1D, 2A to 2C, 3A, 3B, and 4 to 6 , and thus,detailed descriptions of the same elements will be omitted.

Referring to FIGS. 7A and 7B, the digitizer ZM-A may include a basemember PI-A, a first sensing line RF, and a second sensing line CF.

The digitizer ZM-A according to the present embodiment may be providedwith a through-hole CP penetrating the base member PI-A. Thethrough-hole CP may be surrounded by the first sensing line RF and thesecond sensing line CF. However, the location of the through-hole CPaccording to the invention should not be limited thereto or thereby. Thethrough-hole CP may overlap at least one of the sensing lines RF and CFin another embodiment.

The through-hole CP of the present disclosure may be formed bypenetrating the base member PI-A from the front surface Z-U to the rearsurface Z-B. As another way, the through-hole CP may be formed byremoving a portion of the base member PI-A from the front surface Z-U ora portion of the base member PI-A from the rear surface Z-B in the thirddirection DR3 (i.e., the thickness direction of the digitizer ZM-A).However, the way to make the through-hole CP according to the inventionshould not be limited thereto or thereby.

In addition, the through-hole CP may be provided in plural, and thethrough-holes CP may be arranged in a matrix form of four rows by threecolumns within one block defined by the first sensing lines RF and thesecond sensing lines CF. However, the arrangement of through-holes CPaccording to the invention should not be limited thereto or thereby. Asanother way, the through-holes CP may be randomly arranged.

Further, the through-hole CP has a rectangular shape when viewed in aplane (i.e., plan view). However, the shape of the through-hole CPaccording to the invention should not be limited thereto or thereby. Thethrough-hole CP may have a circular shape, an oval shape, or a polygonalshape in another embodiment.

The first sensing line RF described in the following drawings may be oneof the first sensing lines RF1-1, RF1-2, RF1-3, RF2-1, RF2-2, and RF2-3described with reference to FIG. 5 , and the second sensing line CF maybe one of the second sensing lines CF1-1, CF1-2, CF1-3, CF2-1, CF2-2,and CF2-3 described with reference to FIG. 5 .

The base member PI-A may include the front surface Z-U adjacent to thedisplay module DM and the rear surface Z-B opposite to the front surfaceZ-U, which are described with reference to FIG. 6 . The base member PI-Amay include a line area CA in which the sensing lines RF and CF aredisposed and a non-line area NCA disposed between the sensing lines RFand CF. In other words, the non-line area NCA is disposed between twoadjacent line areas CA.

The base member PI-A may be provided with the through-hole CP definedtherethrough from the front surface Z-U to the rear surface Z-B. In anembodiment, the through-hole CP may overlap the non-line area NCA andmay be spaced apart from the line area CA in a plan view.

The through-hole CP has a first width WT1 equal to or greater than about10 micrometers (μm) and equal to or smaller than about 300 μm in thefirst direction DR1. The first width WT1 of the through-hole CP may bedefined by a width measured in the first direction DR1. The firstdirection DR1 crosses the second direction DR2 in which the folding axesAX1 and AX2 described with reference to FIGS. 1B and 1D extend. If thefirst width WT1 is smaller than about 10 μm, the folding characteristicsof the display module DM may be deteriorated by the digitizer ZMdisposed under the display module DM. If the first width WT1 is greaterthan about 300 μm, uneven portions formed by the through-hole CP may beviewed to the user through the display module DM.

The through-hole CP has a fifth width WT5 equal to or greater than about1 millimeters (mm) and equal to or smaller than about 5 mm in the seconddirection DR2 (See FIG. 7A). The fifth width WT5 may be defined by awidth measured in the same direction as the direction in which thefolding axes AX1 and AX2 extend. The through-hole CP has a depth equalto or greater than about 10 μm and equal to or smaller than about 50 μmin the third direction DR3.

In an embodiment, the first sensing line RF and the second sensing lineCF may be spaced apart from each other and may be embedded in the basemember PI-A. In the present disclosure, the expression “embedded” maymean that the first sensing line RF and the second sensing line CF aredisposed inside the base member PI-A regardless of the distinction oflayers.

According to the present disclosure, as the base member PI-A is providedwith the through-hole CP defined therethrough from the front surface Z-Uto the rear surface Z-B, a stress applied to the digitizer ZM-A when thedigitizer ZM-A is folded may be effectively reduced. Accordingly, thereliability of the digitizer ZM-A may be improved, and the foldingcharacteristics of the electronic apparatus EA may be improved.

FIG. 8 is a cross-sectional view showing a digitizer ZM-B according toan embodiment of the present disclosure. FIG. 9 is a cross-sectionalview showing a digitizer ZM-C according to another embodiment of thepresent disclosure. FIG. 10 is a cross-sectional view showing adigitizer ZM-D according to still another embodiment of the presentdisclosure. FIG. 11 is a cross-sectional view showing a digitizer ZM-Eaccording to yet another embodiment of the present disclosure. FIGS. 8to 11 show cross-sections corresponding to the digitizer shown in FIG.7B. In FIGS. 8 to 11 , the same reference numerals denote the sameelements in FIGS. 1A to 7B, and thus, detailed descriptions of the sameelements will be omitted.

Referring to FIG. 8 , the digitizer ZM-B according to the embodiment mayinclude a base member PI-B, a first sensing line RF, and a secondsensing line CF.

The base member PI-B may include a front surface Z-U and a rear surfaceZ-B opposing the front surface Z-U. The base member PI-B may include aline area CA in which the sensing lines RF and CF are disposed and anon-line area NCA disposed between the sensing lines RF and CF. In otherwords, the non-line area NCA is disposed between two adjacent line areasCA.

In the present embodiment, the base member PI-B may be provided with athrough-hole CP and additional holes CP-1 and CP-2, which penetrate atleast a portion of the base member PI-B.

The through-hole CP may overlap the non-line area NCA in a plan view andmay be spaced apart from the line area CA. The through-hole CP maypenetrate the base member PI-B from the front surface Z-U to the rearsurface Z-B.

A first additional hole CP-1 may overlap the line area CA in which thefirst sensing line RF is disposed and may be defined by removing aportion of the base member PI-B from the rear surface Z-B of the basemember PI-B. The first additional hole CP-1 may be defined from the rearsurface Z-B with a certain depth in the third direction DR3 so as notexpose the first sensing line RF.

A second additional hole CP-2 may overlap the line area CA in which thesecond sensing line CF is disposed and may be defined by removing aportion of the base member PI-B from the front surface Z-U of the basemember PI-B. The second additional hole CP-2 may be defined from thefront surface Z-U with a certain depth in the third direction DR3 so asnot expose the second sensing line CF.

However, the location of through-holes according to the invention shouldnot be limited thereto or thereby. The digitizer ZM-B may include anadditional through-hole that overlaps the line area CA in which thefirst sensing line RF is disposed and is defined by removing a portionof the base member PI-B from the front surface Z-U of the base memberPI-B or may further include an additional through-hole that overlaps theline area CA in which the second sensing line CF is disposed and isdefined by removing a portion of the base member PI-B from the rearsurface Z-B of the base member PI-B in another embodiment.

Referring to FIG. 9 , the digitizer ZM-C may include a base member PI-C,first sensing lines RF, and second sensing lines CF.

In the present embodiment, the base member PI-C may include a base layerBS, a first photosensitive resin layer PI1, and a second photosensitiveresin layer PI2. The base layer BS may include a front surface B-U onwhich the first sensing lines RF is disposed and a rear surface B-B onwhich the second sensing lines CF is disposed. The front surface B-U mayface the rear surface B-B.

The base layer BS may include polyimide (PI). The first photosensitiveresin layer PI1 and the second photosensitive resin layer PI2 mayinclude photosensitive polyimide.

Different from the base member PI-A of FIG. 7B in which the sensinglines RF and CF are embedded in the base member PI-A regardless of thedistinction of layers, the sensing lines RF and CF according to thepresent embodiment may be disposed on the front surface B-U and the rearsurface B-B of the base layer BS, respectively, and may be covered bythe photosensitive resin layer PI1 and PI2, respectively.

The base member PI-C may include a front surface Z-U and a rear surfaceZ-B opposing the front surface Z-U. In the present embodiment, the firstphotosensitive resin layer PI1 may provide the front surface Z-U of thebase member PI-C, and the second photosensitive resin layer PI2 mayprovide the rear surface Z-U of the base member PI-C.

The front surface B-U of the base layer BS may include a first line areaCA1 in which the first sensing line RF is disposed and a first non-linearea NCA1 defined between two adjacent first line areas CA1.

The rear surface B-B of the base layer BS may include a second line areaCA2 in which the second sensing line CF is disposed and a secondnon-line area NCA2 defined between two adjacent second line areas CA2.

In the present embodiment, the base member PI-C may be provided withthrough-holes CP-A and CP-B penetrating at least a portion of the basemember PI-C.

The first through-hole CP-A may overlap the first non-line area NCA1 ina plan view and may penetrate the first photosensitive resin layer PI1to expose the front surface B-U of the base layer BS.

The second through-hole CP-B may overlap the second non-line area NCA2in a plan view and may penetrate the second photosensitive resin layerPI2 to expose the rear surface B-B of the base layer BS.

The through-holes CP-A and CP-B each have a second width WT2 equal to orgreater than about 10 μm and equal to or smaller than about 300 μm inthe first direction DR1. The second width WT2 of the through-holes CP-Aand CP-B may be defined by a width measured in the first direction DR1.The first direction DR1 crosses the second direction DR2 in which thefolding axes AX1 and AX2 described with reference to FIGS. 1B and 1Dextend.

If the second width WT2 is smaller than about 10 μm, the foldingcharacteristics of the display module DM may be deteriorated due to thedigitizer ZM-C disposed under the display module DM. If the second widthWT2 is greater than about 300 μm, uneven portions formed by the firstthrough-hole CP-A may be viewed to the user through the display moduleDM.

The first through-hole CP-A may overlap the first non-line areas NCA1and may be spaced apart from the first line area CA1 in a plan view. Thesecond through-hole CP-B may be overlap the second non-line areas NCA2and may be spaced apart from the second line area CA2 in a plan view.Accordingly, the through-holes CP-A and CP-B may be spaced apart fromthe line areas CA1 and CA2.

Referring to FIG. 10 , the digitizer ZM-D may include a base memberPI-D, a first sensing line RF, and a second sensing line CF.

In the present embodiment, the base member PI-D may include a base layerBS, a first photosensitive resin layer PI1, and a second photosensitiveresin layer PI2. The base layer BS may include a front surface B-U onwhich the first sensing lines RF are disposed and a rear surface B-B onwhich the second sensing lines CF are disposed. The front surface B-Umay face the rear surface B-B.

The base layer BS may include polyimide (PI). The first photosensitiveresin layer PI1 and the second photosensitive resin layer PI2 mayinclude photosensitive polyimide.

The base member PI-D may include a front surface Z-U and a rear surfaceZ-B opposing the front surface Z-U. In the present embodiment, the firstphotosensitive resin layer PI1 may provide the front surface Z-U of thebase member PI-D, and the second photosensitive resin layer PI2 mayprovide the rear surface Z-B of the base member PI-D.

The front surface B-U of the base layer BS may include a first line areaCA1 in which the first sensing line RF is disposed and a first non-linearea NCA1 defined between the first sensing lines.

The rear surface B-B of the base layer BS may include a second line areaCA2 in which the second sensing line CF is disposed and a secondnon-line area NCA2 defined between the second sensing lines.

In the present embodiment, the base member PI-D may be provided withthrough-holes CP-A1 and CP-B1 and additional holes CP-A2 and CP-B2,which penetrate at least a portion of the base member PI-D.

The first through-hole CP-A1 may overlap the first non-line area NCA1 ina plan view and may penetrate the first photosensitive resin layer PI1to expose the front surface B-U of the base layer BS.

The second through-hole CP-B1 may overlap the second non-line area NCA2in a plan view and may penetrate the second photosensitive resin layerPI2 to expose the rear surface B-B of the base layer BS.

The first additional hole CP-A2 may overlap the first line area CA1 inwhich the first sensing line RF is disposed and may be defined byremoving a portion of the first photosensitive resin layer PI1 from thefront surface of the first photosensitive resin layer PI1 (i.e., thefront surface Z-U of the base member PI-D). The first additional holeCP-A2 may be defined from the front surface of the first photosensitiveresin layer PI1 with a certain depth in the third direction DR3 so asnot expose the first sensing line RF.

The second additional hole CP-B2 may overlap the second line area CA2 inwhich the second sensing line CF is disposed and may be defined byremoving a portion of the second photosensitive resin layer PI2 from therear surface of the second photosensitive resin layer PI2 (i.e., therear surface Z-B of the base member PI-D). The second additional holeCP-B2 may be defined from the rear surface of the second photosensitiveresin layer PI2 with a certain depth in the third direction DR3 so asnot expose the second sensing line CF.

Referring to FIG. 11 , the digitizer ZM-E may be provided withthrough-holes CP-3 and CP-4 penetrating a base member PI-E.

The base member PI-E may include a front surface Z-U and a rear surfaceZ-B opposing the front surface Z-U. The base member PI-E may include aline area CA in which sensing lines RF and CF are disposed and anon-line area NCA defined between the sensing lines RF and CF.

In an embodiment, the through-holes CP-3 and CP-4 may have differentwidths from each other in the first direction DR1. For example, thethird through-hole CP-3 may have a third width WT3, and the fourththrough-hole CP-4 may have a fourth width WT4. The fourth width WT4 maybe greater than the third width WT3. Each of the third width WT3 and thefourth width WT4 may be equal to or greater than about 10 μm and equalto or smaller than about 300 μm.

FIG. 11 shows two through-holes CP-3 and CP-4 having different widthsfrom each other. However, the number of kinds of the through-holesaccording to the invention should not be limited thereto or thereby. Thebase member PI-E may be provided with three or more kinds ofthrough-holes having different widths from each other in anotherembodiment, and the number of kinds should not be particularly limited.

Although the embodiments of the present disclosure have been described,it is understood that the present disclosure should not be limited tothese embodiments but various changes and modifications can be made byone ordinary skilled in the art within the spirit and scope of thepresent disclosure as hereinafter claimed.

Therefore, the disclosed subject matter should not be limited to anysingle embodiment described herein, and the scope of the presentinventive concept shall be determined according to the attached claims.

What is claimed is:
 1. A digitizer comprising: a base member comprisinga front surface and a rear surface opposing the front surface; firstsensing lines disposed on the base member, arranged in a firstdirection, and extending in a second direction crossing the firstdirection; and second sensing lines disposed on the base member, spacedapart from the first sensing lines, arranged in the second direction,and extending in the first direction, wherein the base member isfoldable about an imaginary folding axis extending in the seconddirection and is provided with a through-hole penetrating at least aportion thereof, and the through-hole is surrounded by the first sensinglines and the second sensing lines. wherein the base member comprises: abase layer comprising a front surface on which the first sensing linesare disposed and a rear surface on which the second sensing lines aredisposed, the rear surface opposing the front surface; a firstphotosensitive resin layer disposed on the front surface of the baselayer and providing the front surface of the base member; and a secondphotosensitive resin layer disposed on the rear surface of the baselayer and providing the rear surface of the base member, wherein thefront surface of the base layer comprises a first line area in which thefirst sensing lines are disposed and a first non-line area definedbetween the first sensing lines, and the rear surface of the base layercomprises a second line area in which the second sensing lines aredisposed and a second non-line area defined between the second sensinglines.
 2. The digitizer of claim 1, wherein the through-hole comprises:a first through-hole overlapping the first non-line area in a plan viewand penetrating the first photosensitive resin layer to expose the frontsurface of the base layer; and a second through-hole overlapping thesecond non-line area in the plan view and penetrating the secondphotosensitive resin layer to expose the rear surface of the base layer.3. The digitizer of claim 2, wherein the base member further defines: afirst additional hole overlapping the first line area and defined fromthe front surface of the base member with a certain depth; and a secondadditional hole overlapping the second line area and defined from therear surface of the base member with a certain depth.
 4. An electronicapparatus comprising: a window; a display module disposed under thewindow; and a digitizer disposed under the display module, wherein thedigitizer comprises: a base member comprising a front surface adjacentto the display module and a rear surface opposing the front surface; andfirst and second sensing lines disposed on the base member, arranged ina first direction and a second direction, respectively, spaced apart andinsulated from each other, the second direction crossing the firstdirection, wherein the display module is foldable about an imaginaryfolding axis extending in the second direction, the digitizer isprovided with a through-hole penetrating at least a portion of the basemember, and the through-hole is surrounded by the first sensing linesand the second sensing lines, wherein the base member comprises: a baselayer comprising a front surface on which the first sensing lines aredisposed and a rear surface on which the second sensing lines aredisposed, the rear surface opposing the front surface; a firstphotosensitive resin layer disposed on the front surface of the baselayer and providing the front surface of the base member; and a secondphotosensitive resin layer disposed on the rear surface of the baselayer and providing the rear surface of the base member, wherein thefront surface of the base layer comprises a first line area in which thefirst sensing lines are disposed and a first non-line area definedbetween the first sensing lines, and the rear surface of the base layercomprises a second line area in which the second sensing lines aredisposed and a second non-line area defined between the second sensinglines.
 5. The electronic apparatus of claim 4, wherein the through-holecomprises: a first through-hole overlapping the first non-line area in aplan view and penetrating the first photosensitive resin layer to exposethe front surface of the base layer; and a second through-holeoverlapping the second non-line area in the plan view and penetratingthe second photosensitive resin layer to expose the rear surface of thebase layer.
 6. The electronic apparatus of claim 5, wherein the basemember further defines: a first additional hole overlapping the firstline area and defined from the front surface of the base member with acertain depth; and a second additional hole overlapping the second linearea and defined from the rear surface of the base member with a certaindepth.